How 3D Printing of Rare Metals Revolutionizes Semiconductor Manufacturing

3D printing (additive manufacturing) technology is reshaping the manufacturing industry at an unprecedented speed. Among various application fields, the semiconductor industry - the "heart" of modern technology - has set the highest standards for 3D printing technology: extremely high purity, outstanding corrosion resistance, and excellent high-temperature performance. And rare metals such as niobium and tantalum are the ideal materials to meet these stringent requirements.

How to choose between 3D-printed wire and rod made of niobium and tantalum materials?

This is a common but crucial question. The answer is: Both are needed, but they are suitable for different 3D printing processes.

1. Silk material - Mainly used for arc additive manufacturing
What is a filament? A metal filament is a linear material wound into a coil, with a diameter usually ranging from 1.0 to 2.0 mm.
Applicable process: WAAM. This is a 3D printing technology that uses an electric arc as the heat source and a metal wire as the filler material. Its advantages include high deposition efficiency and relatively low cost, making it highly suitable for manufacturing large-sized, moderately complex near-net-shape parts.

Application scenario: When you need to print a large semiconductor equipment chamber support, a large crucible mold, or certain non-core but corrosion-resistant structural components, using niobium wire, niobium C103 wire, or tantalum wire for WAAM printing is an economical and efficient option.

2. Rod material - Mainly used in powder bed fusion technology
What is a bar stock? Metal bars are the raw materials used to produce metal powder.
Core Function: Currently, 3D printing processes capable of producing high-purity, spherical, and uniformly sized niobium and tantalum metal powders (such as SLM selective laser melting or EBM electron beam melting) are crucial for the production of high-performance precision parts. These high-quality powders are precisely manufactured through plasma rotating electrode method or gas atomization method, using high-purity niobium rods and tantalum rods. Application scenario: When it is necessary to manufacture core components in semiconductor equipment that have extremely complex structures, precise dimensions, and extremely high performance requirements (such as liners, nozzles, diffusion plates), it is necessary to use powder made from rods and print them using SLM/EBM processes.

Wire is "printing material" and is directly used in the WAAM process; while the bar is "base material" and is used to prepare the metal powder required for the SLM/EBM processes. Both play different but complementary roles in the 3D printing industry chain, jointly constituting the complete material system for rare metal additive manufacturing.

The semiconductor manufacturing environment is extremely harsh, involving high temperatures, strong corrosive gases (such as chlorine, hydrogen fluoride), and plasma bombardment. Traditional processing methods (such as casting and machining) encounter significant challenges when manufacturing internal cooling channels or integrated structures with complex shapes. 3D printing technology precisely fills these gaps.

1. Application fields:
Etching process chamber components: In dry etching, the components within the chamber, such as the focusing ring, gas nozzles, and protective liners, need to withstand intense plasma corrosion. 3D-printed tantalum or niobium C103 components, with their excellent corrosion resistance and customizable complex geometries, can significantly extend component lifespan, reduce equipment downtime, and ensure process stability. Chemical Vapor Deposition Holder: In the CVD process, the base used to fix and heat the wafer needs to maintain its size stable at high temperatures and not react with the reaction gases. 3D-printed niobium materials (such as C103, with excellent high-temperature strength) can be used to manufacture an integrated base with optimized channels, achieving a more uniform temperature distribution and airflow, and improving the quality of film deposition.

Thermal management components: Many components in semiconductor devices require efficient cooling. 3D printing can produce heaters or fixtures with complex conformal cooling channels that cannot be achieved by traditional methods. By using materials with good thermal conductivity and combining this design, the heat dissipation efficiency can be significantly improved, ensuring the thermal stability of the process.

Ultra-high purity fluid delivery system: For the transportation of high-purity special gases or ultra-pure water, the smoothness of the inner walls and corrosion resistance of the system are of vital importance. 3D printing can be used to integrate the manufacturing of complex valves, joints and pipes, reducing welds and connection points, thereby minimizing the risk of contamination. Post-processing (such as electrolytic polishing) of 3D-printed tantalum pipes is an ideal choice.

Fortu Tech supplies Niobium wire and Tantalum Wire products to multiple countries and regions around the world. Its service coverage includes the United States, Canada, Russia, Germany, France, the United Kingdom, Italy, Sweden, Austria, the Netherlands, Belgium, Switzerland, Spain, Czech Republic, Poland, Japan, South Korea, as well as Chile, Brazil, Argentina, Colombia and other places in Latin America.

Fortu Tech can produce and process niobium pellet, niobium foil, niobium Capillary Tube, niobium billet, niobium sheet & plate, niobium rod, niobium tubes.